Chamber system and heat-insulating panel

ABSTRACT

A chamber system includes: a housing section that is surrounded by a bottom part, a side wall part, and a ceiling part and houses a processing apparatus; and a heat-insulating section that is provided in each of the bottom part, the side wall part, and the ceiling part, and regulates transfer of heat between the housing section and the outside of the housing section.

This application is a Continuation application of InternationalApplication No. PCT/JP2013/050398 filed on Jan. 11, 2013, which claimspriority on Japanese Patent Application No. 2012-005145 filed on Jan.13, 2012, and Japanese Patent Application No. 2012-006180 filed on Jan.16, 2012. The contents of the above applications are incorporated hereinby reference.

BACKGROUND

1. Field of the Invention

The present invention relates to a chamber system and a heat-insulatingpanel.

2. Background

In processing apparatuses, such as measuring apparatuses, manufacturingapparatuses, and machining apparatuses, processing precision may varydepending on, for example, changes in a surrounding environment, such astemperature. For this reason, a processing apparatus may be housed andused in a chamber system where its surrounding environment is easily anduniformly adjusted or the like (for example, refer to PCT InternationalPublication No. WO 2008/090975).

SUMMARY

However, in the above chamber system, when heat-insulating propertiesare insufficient, transfer of heat occurs to the inside and to theoutside of a chamber system, and the precision of the processingapparatus may be influenced.

In addition, in the above chamber system, when sound-insulatingproperties are insufficient, transmission of vibration due to soundoccurs to the inside and to the outside of the chamber system, and theprecision of the processing apparatus may be influenced.

An object of an aspect of the invention is to provide a chamber systemand a heat-insulating panel having excellent heat-insulating properties.

Another object is to provide a chamber system having excellentsound-insulating properties.

According to an aspect of the invention, a chamber system is provided,including a housing section that is surrounded by a bottom part, a sidewall part, and a ceiling part and houses a processing apparatus; and aheat-insulating section that is provided in each of the bottom part, theside wall part, and the ceiling part, and regulates transfer of heatbetween the housing section and the outside of the housing section.

According to another aspect of the invention, a heat-insulating panel isprovided, including a pair of substrates; a heat transfer-suppressinglayer sandwiched between the pair of substrates; and asubstrate-supporting portion that is provided in the heattransfer-suppressing layer and supports a portion between the pair ofsubstrates.

According to still another aspect of the invention, a chamber system isprovided, including a housing section that is surrounded by a bottompart, a side wall part, and a ceiling part and houses a processingapparatus; an atmosphere-adjusting section that adjusts the atmosphereinside the housing section; and an aerial vibration-attenuating sectionthat is provided in each of the bottom part, the side wall part, theceiling part, and the atmosphere-adjusting section and attenuates aerialvibration outside the housing section.

According to an aspect of the invention, a chamber system and aheat-insulating panel having excellent heat-insulating properties can beprovided.

Additionally, according to an aspect of the invention, a chamber systemhaving excellent sound-insulating properties can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a view illustrating an overall configuration of a chambersystem related to a first embodiment of the invention.

FIG. 2 is a cross-sectional view illustrating the configuration of aheat-insulating panel of the chamber system related to the presentembodiment.

FIG. 3 is a cross-sectional view illustrating the configuration of theheat-insulating panel of the chamber system related to the presentembodiment.

FIG. 4 is a cross-sectional view illustrating the configuration of theheat-insulating panel of the chamber system related to the presentembodiment.

FIG. 5 is a view illustrating another configuration of theheat-insulating panel of the chamber system related to the presentembodiment.

FIG. 6 is a view illustrating still another configuration of theheat-insulating panel of the chamber system related to the presentembodiment.

FIG. 7 is a view illustrating a still further configuration of theheat-insulating panel of the chamber system related to the presentembodiment.

FIG. 8 is a view illustrating a still further configuration of theheat-insulating panel of the chamber system related to the presentembodiment.

FIG. 9 is a view illustrating a still further configuration of theheat-insulating panel of the chamber system related to the presentembodiment.

FIG. 10 is a view illustrating another configuration of the chambersystem related to the present embodiment.

FIG. 11 is a view illustrating still another configuration of thechamber system related to the present embodiment.

FIG. 12 is a view illustrating the configuration of a chamber systemrelated to a second embodiment of the invention.

FIG. 13 is a view illustrating the configuration of a portion of asound-insulating panel related to the present embodiment.

FIG. 14 is a view illustrating the principle of Helmholtz resonance.

FIG. 15 is a view illustrating the configuration of a portion of aHelmholtz sound absorber related to the present embodiment.

FIG. 16 is a view illustrating the principle of Helmholtz resonance.

FIG. 17 is a view illustrating the configuration of a silencing hoserelated to the present embodiment.

FIG. 18 is a view illustrating the configuration of a chamber systemrelated to a third embodiment of the invention.

FIG. 19 is a view illustrating the configuration of a chamber systemrelated to a fourth embodiment of the invention.

FIG. 20 is a view illustrating the configuration of a chamber systemrelated to a fifth embodiment of the invention.

FIG. 21 is a view illustrating the configuration of a chamber systemrelated to a sixth embodiment of the invention.

FIG. 22 is a view illustrating the configuration of a chamber systemrelated to a seventh embodiment of the invention.

FIG. 23 is a view illustrating another configuration of thesound-insulating panel related to the present embodiment.

FIG. 24 is a view illustrating still another configuration of thesound-insulating panel related to the present embodiment.

FIG. 25 is a view illustrating a still further configuration of thechamber system related to the present embodiment.

FIG. 26 is a view illustrating a still further configuration of thechamber system related to the present embodiment.

FIG. 27 is a view illustrating a still further configuration of thechamber system related to the present embodiment.

FIG. 28 is a graph illustrating results obtained by performing acousticanalysis of the chamber system related to the present embodiment.

FIG. 29 is a graph illustrating results obtained by performing acousticanalysis of the chamber system related to the present embodiment.

FIG. 30 is a view illustrating a still further configuration of thechamber system related to the present embodiment.

FIG. 31 is a view illustrating a still further configuration of thechamber system related to the present embodiment.

FIG. 32 is a view illustrating a still further configuration of thechamber system related to the present embodiment.

DESCRIPTION OF THE EMBODIMENTS

Hereinafter, embodiments of the invention will be described withreference to the drawings. In addition, in the following drawings,scales of respective members are appropriately changed in order to makerespective members have recognizable sizes. Additionally, in thefollowing description, an XYZ rectangular coordinate system is set, andthe positional relationship of the respective members may be describedreferring to this XYZ rectangular coordinate system.

In the present embodiments, a predetermined direction within ahorizontal plane is defined as an X-axis direction, a directionorthogonal to the X-axis direction within the horizontal plane isdefined as a Y-axis direction, and a direction (that is, a verticaldirection) orthogonal to the X-axis direction and the Y-axis directionis defined as a Z-axis direction.

First Embodiment

Hereinafter, a first embodiment of the invention will be described.

FIG. 1 is a view illustrating the configuration of a chamber system 100related to the present embodiment.

As illustrated in FIG. 1, the chamber system 100 has a housing section40 surrounded by a bottom part 10, side wall parts 20, and a ceilingpart 30, heat-insulating sections 50 provided at the bottom part 10, theside wall parts 20, and the ceiling part 30, and a temperature-adjustingsection 60 that adjusts the temperature of the housing section 40. Thechamber system 100 is used after being placed, for example, on a floorsurface FL of a factory or the like.

The housing section 40 is a space that houses a processing apparatus PA.The housing section 40 is connected to an atmosphere-adjusting section(not illustrated) so that, for example, the atmosphere around theprocessing apparatus PA can be adjusted. The processing apparatus PAhoused in the housing section 40 includes, for example, at least one ofa measuring apparatus, a manufacturing apparatus, and a machiningapparatus. The number of processing apparatuses PA to be housed in thehousing section 40 may be one or may be two or more.

The processing apparatus PA has an apparatus body MB that performsprocessing (for example, measurement processing, manufacturingprocessing, machining processing, or the like) corresponding to therespective apparatuses, and a supporting base BS that supports theapparatus body MB. A heat generator HE that generates heat due to theabove respective processings is included in, for example, the apparatusbody MB of the processing apparatus PA.

The supporting base BS is placed on the bottom part 10 to support theapparatus body MB. Accordingly, the apparatus body MB is supported by aportion of the bottom part 10 via the supporting base BS. A plurality ofthe supporting bases BS are provided so as to support a plurality ofplaces in the apparatus body MB. In addition, there may be onesupporting base BS.

Each heat-insulating section 50 regulates transfer of heat between thehousing section 40 and the outside of the housing section 40. Theheat-insulating sections 50 have a plurality of heat-insulating panels101 and a plurality of heat-insulating panels 102.

The heat-insulating panels 101 are used as constituent members thatconstitute the side wall parts 20 and the ceiling part 30. In this way,the heat-insulating panels 101 are used as the heat-insulating sections50 and are used as portions of the side wall parts 20 and the ceilingpart 30.

Each side wall part 20 is formed in a state where the side wall partstands vertically with respect to the floor surface FL. The side wallpart 20 has wall portions 20 a surrounding four sides (+X-side, −X-side,+Y-side, and −Y-side) of the housing section 40. Each wall portion 20 ahas a configuration in which a plurality of heat-insulating panels 101are arranged without gaps therebetween. A connecting portion between theheat-insulating panels 101 is sealed with, for example, an adhesive (notillustrated), and is fixed by a fixture (not illustrated) or the like.

The side wall part 20 is provided so that two wall portions 20 a amongthe four wall portions 20 a formed by the plurality of suchheat-insulating panels 101 face each other.

The ceiling part 30 is provided on the +Z-side of the side wall part 20,and is arranged parallel to the floor surface FL. The ceiling part 30has a ceiling plate 30 a that seals the +Z-side of the housing section40. The ceiling plate 30 a has a configuration in which a plurality ofheat-insulating panels 101 are arranged without gaps therebetween in anX direction and in a Y direction.

The connecting portion between the heat-insulating panels 101 is sealedwith, for example, an adhesive (not illustrated), and is fixed by afixture (not illustrated) or the like.

The heat-insulating panels 102 are constituent members that constitutethe bottom part 10. In this way, the heat-insulating panels 102 are usedas the heat-insulating sections 50 and are used as portions of thebottom part 10. For this reason, the transfer of heat between thehousing section and the outside (for example, the floor surface FL)thereof is also regulated in the bottom part 10 on which the processingapparatus PA that is a heavy load is placed.

The bottom part 10 is placed on the floor surface FL. The bottom part 10has a bottom plate 10 a placed on the floor surface FL. The bottom plate10 a has a configuration in which a plurality of heat-insulating panels102 are arranged without gaps therebetween in the X direction and in theY direction.

The connecting portion between the heat-insulating panels 102 is sealedwith, for example, an adhesive (not illustrated), and is fixed by afixture (not illustrated) or the like. The bottom plate 10 a is formedso as to protrude in one direction (for example, in the −X direction)from the housing section 40. A portion of the temperature-adjustingsection 60 is placed on the portion of the bottom part 10 that protrudesfrom the housing section 40.

The temperature-adjusting section 60 allows a temperature-adjustingmedium to flow between the temperature-adjusting section and the housingsection 40, thereby adjusting the temperature inside the housing section40. The temperature-adjusting section 60 has a gas supply system 61, anexhaust system 62, a temperature-adjusting system 63, a second supplysystem 64, and a heat-insulating section 65.

The gas supply system 61 supplies, for example, a temperature-adjustinggas, such as air or nitrogen, as a temperature-adjusting medium to thehousing section 40. The gas supply system 61 has a gas flow pipe 61 aand a duct 61 b.

The gas flow pipe 61 a has one end connected to thetemperature-adjusting system 63 and the other end connected to the duct61 b. The gas flow pipe 61 a allows the temperature-adjusting gassupplied from the temperature-adjusting system 63 to flow into the duct61 b. The duct 61 b is provided in a portion of the side wall part 20,and is connected to the housing section 40. The duct 61 b jets thetemperature-adjusting gas from the gas flow pipe 61 a into the housingsection 40.

The exhaust system 62 exhausts the gas in the housing section 40 to theoutside of the housing section 40. The exhaust system 62 has a gas flowpipe 62 a and a duct 62 b. The gas flow pipe 62 a has one end connectedto the temperature-adjusting system 63 and the other end connected tothe duct 62 b. The gas flow pipe 62 a allows the gas from the duct 62 bto flow to the temperature-adjusting system 63.

The duct 62 b is provided in a portion of the side wall part 20, and isconnected to the housing section 40. The −Z-side of the duct 62 b isplaced on, for example, the bottom part 10. The duct 62 b jets off thegas of the housing section 40 to the gas flow pipe 62 a.

The temperature-adjusting system 63 adjusts the temperature of the gasexhausted by the exhaust system 62, and returns the gas to the gassupply system 61 as the temperature-adjusting gas. Thetemperature-adjusting system 63 has a cooling unit 63 a that cools theexhausted gas, and a heating unit 63 b that heats the gas cooled by thecooling unit 63 a. The cooling unit 63 a is connected to the gas flowpipe 62 a of the exhaust system 62. The cooling unit 63 a has a coolingmechanism (not illustrated) that cools gas, using, for example, arefrigerant.

The heating unit 63 b is connected to the cooling unit 63 a. As theheating unit 63 b, for example, a heating mechanism (not illustrated),such as a heater, is used. A temperature-adjusting gas adjusted to apredetermined temperature is generated by heating the gas cooled by thecooling unit 63 a, using the heating unit 63 b. Although most of thegenerated temperature-adjusting gas is returned to the gas supply system61, a portion thereof is supplied to the second supply system 64.

The second supply system 64 locally supplies the temperature-adjustinggas to the processing apparatus PA. The second supply system 64 isprovided with a control unit (not illustrated) that controls the supplyamount, temperature, direction, or the like of the temperature-adjustinggas. The second supply system 64 has a second supply pipe 64 a havingone end portion connected to the heating unit 63 b and the other endportion connected to the inside of the apparatus body MB.

The second supply pipe 64 a is provided through the side wall part 20.The above other end portion of the second supply pipe 64 a is directedto the heat generator HE.

In this configuration, the second supply system 64 is able to locallysupply the temperature-adjusting gas to the heat generator HE includedin the apparatus body MB. In addition, it is possible to adjust theposition of the other end portion of the second supply pipe 64 a,thereby locally supplying the temperature-adjusting gas to a portiondifferent from the heat generator HE.

For example, a configuration may be adopted in which the other endportion of the second supply pipe 64 a is arranged at a portion betweena plurality of the supporting bases BS, outside the apparatus body MB,or the like to thereby supply the temperature-adjusting gas to theseportions.

Since the portion between the supporting bases BS or the portion of theapparatus body MB on the +X-side is located on the downstream side of aflow of the temperature-adjusting gas supplied from the gas supplysystem 61, drift may occur or particles or the like of the housingsection 40 may be deposited. The occurrence of drift or the depositionof particles is reduced by locally supplying the temperature-adjustinggas to such a portion.

Additionally, a configuration may be adopted in which a plurality of thesecond supply pipes 64 a are provided. In this case, thetemperature-adjusting gas can be locally supplied to a plurality ofplaces.

The temperature-adjusting gas supplied to the heat generator HE adjuststhe temperature of a space around the heat generator HE. In addition,the temperature-adjusting gas used for the temperature adjustment isreleased to the outside (that is, the housing section 40) of theprocessing apparatus PA from an exhaust part (not illustrated), and isexhausted to the outside of the housing section 40 by the exhaust system62.

By providing the second supply system 64 that locally supplies thetemperature-adjusting gas to the heat generator HE of the processingapparatus PA, unevenness, drift, or the like of a flow of thetemperature-adjusting gas that is supplied by, for example, the gassupply system 61 is reduced, and deposition of particles in the vicinityof the processing apparatus PA (for example, between the supportingbases BS or the like) is reduced.

The heat-insulating section 65 suppresses the transfer of heat betweenthe inside and outside of the temperature-adjusting section 60. Theheat-insulating section 65 has a plurality of heat insulation members103. As the heat insulation members 103, for example, a configuration inwhich an insulating material, such as foamed urethane, is formed in alayered fashion, heat-insulating panels having the same configuration asthe above heat-insulating panels 101 and the heat-insulating panels 102,or the like can be used.

The heat insulation members 103 are provided in the gas supply system61, the exhaust system 62, the temperature-adjusting system 63, and thesecond supply system 64.

Specifically, the heat insulation members 103 are arranged so as tocover an outer peripheral surface of the gas flow pipe 61 a and an outerperipheral surface of the duct 61 b in the gas supply system 61, anouter peripheral surface of the gas flow pipe 62 a and an outerperipheral surface of the duct 62 b in the exhaust system 62, an outersurface of the temperature-adjusting system 63, and an outer peripheralsurface of the second supply pipe 64 a of the second supply system 64without gaps therebetween.

In this way, since the temperature-adjusting section 60 and the outsideare partitioned off from each other by the heat-insulating section 65without gaps therebetween, the transfer of heat between thetemperature-adjusting section 60 and the outside (including the insideof the housing section 40) is regulated.

FIG. 2 is a cross-sectional view illustrating the configuration of aheat-insulating panel 101.

As illustrated in FIG. 2, the heat-insulating panel 101 has a pair ofsubstrates (a first substrate 51 and a second substrate 52), a heattransfer-suppressing layer 53 sandwiched by the first substrate 51 andthe second substrate 52.

As the first substrate 51 and the second substrate 52, for example, asubstrate formed of a resin material, such as plastics, a substrateformed of a metallic material, such as stainless steel, or the like canbe used. A configuration may be adopted in which heat is reflected byproviding copper foil, aluminum foil, or the like on the front surfacesor inner surfaces of the first substrate 51 and the second substrate 52.

The heat transfer-suppressing layer 53 includes a heat-insulatingmaterial layer or a vacuum layer that suppresses the transfer of heat.As the heat-insulating material layer, for example, a configurationobtained using foamed urethane or the like may be adopted. As the vacuumlayer, for example, a configuration may be adopted in which a spacebetween the first substrate 51 and the second substrate 52 is sealed soas to have a pressure of about 10⁻³ Pa.

Additionally, as a heat transfer-suppressing layer 53, a configurationmay be adopted in which a heat-insulating material layer formed of afiber-based core material, such as a glass fiber, and a vacuum layersealed so that the pressure thereof becomes about 1 Pa to 10 Pa areincluded.

FIG. 3 is a cross-sectional view illustrating the configuration of aheat-insulating panel 102. FIG. 4 is a view illustrating a configurationalong an A-A cross-section in FIG. 3.

As illustrated in FIG. 3, the heat-insulating panel 102 has the pair ofsubstrates (the first substrate 51 and the second substrate 52), theheat transfer-suppressing layer 53 sandwiched by the first substrate 51and the second substrate 52, and a reinforcing member 54 that reinforcesthe first substrate 51 and the second substrate 52. The configuration ofthe first substrate 51 and the second substrate 52 is the same as thatof the heat-insulating panel 101.

The reinforcing member 54 has a first reinforcing substrate 55 thatreinforces the first substrate 51, a second reinforcing substrate 56that reinforces the second substrate 52, and a substrate-supportingportion 57 that supports the first reinforcing substrate 55 and thesecond reinforcing substrate 56. The first reinforcing substrate 55, thesecond reinforcing substrate 56, and the substrate-supporting portion 57are formed of for example, a metallic material.

The substrate-supporting portion 57 is provided through the firstsubstrate 51, the heat transfer-suppressing layer 53, and the secondsubstrate 52. Accordingly, a portion of the substrate-supporting portion57 is arranged in the heat transfer-suppressing layer 53.

Additionally, a plurality of substrate-supporting portions 57 areprovided. The plurality of substrate-supporting portions 57 are arrangedin a matrix in a plan view, for example, as illustrated in FIG. 4. InFIG. 4, the substrate-supporting portions 57 are arranged so as tobecome three rows×three columns, but are not limited to thisarrangement.

Additionally, as illustrated in FIG. 1, for example, the processingapparatus PA is placed on the heat-insulating panels 102 provided on thebottom part 10 via the supporting bases BS. Additionally, an objectdifferent from the processing apparatus PA or the supporting bases maybe placed on the heat-insulating panels 102, or a worker may ride on theheat-insulating panels.

For this reason, there is a great necessity for a configuration in whichthe first substrate 51, the second substrate 52, and the heattransfer-suppressing layer 53 that constitute each heat-insulating panel102 are not easily deformed against the load of the heat-insulatingpanel 102 in a thickness direction (a direction directed from the firstsubstrate 51 to the second substrate 52).

In contrast, in the present embodiment, the heat-insulating panel 102provided on the bottom part 10 has the first reinforcing substrate 55,the second reinforcing substrate 56, and the substrate-supportingportions 57. Therefore, the first substrate 51, the second substrate 52,and the heat transfer-suppressing layer 53 are configured so as not tobe easily deformed against the load of the heat-insulating panel 102 inthe thickness direction.

In the above configuration, the heat-insulating sections 50 (theheat-insulating panels 101 or the heat-insulating panels 102) arearranged on the entire surface of an outer wall portion including thebottom part 10, the side wall parts 20, and the ceiling part 30, whichsurrounds the housing section 40. Therefore, the housing section 40 isisolated from the outside in the state of being surrounded by theheat-insulating sections 50. For this reason, the state between theinside and outside of the housing section 40, also including the bottompart 10, is brought into a state where the transfer of heat isregulated.

Additionally, since the chamber system 100 is in the state of beingsealed by the heat-insulating sections 50 and the heat-insulatingsection 65, the inside and outside of the chamber system 100 areisolated from each other via the heat-insulating sections 50 and theheat-insulating section 65. For this reason, the state between theinside and outside of the chamber system 100 is brought into a statewhere the transfer of heat is regulated.

As described above, the chamber system 100 related to the presentembodiment includes the housing section 40 that is surrounded by thebottom part 10, the side wall parts 20, and the ceiling part 30 andhouses the processing apparatus PA, and the heat-insulating sections 50that are provided at the bottom part 10, the side wall parts 20, and theceiling part 30, and regulate the transfer of heat between the housingsection 40 and the outside of the housing section 40. Thus, the transferof heat between the inside and outside of the housing section 40 can beregulated not only in the side wall parts 20 and the ceiling part 30 butalso in the bottom part 10.

This can maintain a temperature environment around the processingapparatus PA. In this way, a chamber system 100 having excellentheat-insulating properties can be provided.

Additionally, the heat-insulating panel 102 related to the presentembodiment includes the pair of substrates (the first reinforcingsubstrate 55 and the second reinforcing substrate 56), the heattransfer-suppressing layer 53 sandwiched by the first reinforcingsubstrate 55 and the second reinforcing substrate 56, and thesubstrate-supporting portions 57 that are provided in the heattransfer-suppressing layer 53 and support a portion between the pair ofsubstrates. Thus, even if a load such that a heavy load is placed isadded, a heat-insulating panel 102 that is not easily deformed in thethickness direction can be provided.

The technical range of the invention is not limited to the aboveembodiment, and changes can be appropriately added without departingfrom the scope of the invention.

For example, in the above embodiment, in each of the individualheat-insulating panels 102 that constitute the bottom part 10, aconfiguration in which the substrate-supporting portions 57 are formedso as to be uniformly arranged has been described as an example.However, the configuration of the heat-insulating panel is not limitedto this configuration.

For example, as illustrated in FIG. 5, a configuration may be adopted inwhich the density of the substrate-supporting portions 57 provided inthe heat-insulating panel 102 on which the supporting bases BS areplaced among the plurality of heat-insulating panels 102 is made greaterthan the density of the substrate-supporting portions 57 provided in theother heat-insulating panels 102.

Additionally, for example, when a supporting base BS is arranged over aplurality of heat-insulating panels 102, not only a configuration inwhich the density of the substrate-supporting portions 57 is adjustedfor each heat-insulating panel 102, but also, for example, aconfiguration in which the density of the substrate-supporting portions57 becomes higher in the portions of the plurality of heat-insulatingpanels 102 that overlap the supporting base BS may be adopted.

In this configuration, the density of the substrate-supporting portions57 may vary depending on portions if attention is paid to the individualheat-insulating panels 102. In this case, for example, the region of thebottom part 10 on which the supporting base BS is placed may be set inadvance, and the heat-insulating panels 102 of which the density of thesubstrate-supporting portions 57 is adjusted so as to correspond to theregion on which the supporting base BS is placed may be used.

Additionally, in the above embodiment, a configuration in which theinside of each substrate-supporting portion 57 is solid has beendescribed as an example. However, the configuration of thesubstrate-supporting portion is not limited to this configuration. Forexample, as illustrated in FIG. 6, a configuration may be adopted inwhich a hollow portion 58 a is provided inside each substrate-supportingportion 57. By providing the hollow portion 58 a inside thesubstrate-supporting portion 57, the transfer of heat in a path from thefirst reinforcing substrate 55 through the substrate-supporting portion57 to the second reinforcing substrate 56 can be suppressed.

In addition, this configuration is more effective when the firstreinforcing substrate 55, the substrate-supporting portion 57, and thesecond reinforcing substrate 56 are formed of a material, such as metal,having a high thermal conductivity. Additionally, in this case, asillustrated in FIG. 6, a configuration may be adopted in which arefrigerant 58 p is held by the hollow portion 58 a. This can furthersuppress the transfer of heat in the above path.

Additionally, in the configuration of the above embodiment, theconfiguration of the connecting portion between the heat-insulatingpanels 102 can be deformed. For example, as illustrated in FIGS. 7 and8, a configuration can be adopted in which the connecting portionbetween the heat-insulating panels 102 is provided with a connectionframe 59. In addition, FIG. 7 is a plan view illustrating a state wheretwo heat-insulating panels 102 are connected to each other using theconnection frame 59, and FIG. 8 is a view illustrating a configurationalong a B-B cross-section in FIG. 7.

As illustrated in FIGS. 7 and 8, the connection frame 59 is formedusing, for example, a high-rigidity material, such as a metallicmaterial. The connection frame 59 has an outer frame portion 59 a and acoupling portion 59 b. The outer frame portion 59 a holds sides otherthan sides, adjacent to each other, of the two heat-insulating panels102. The coupling portion 59 b holds the sides, adjacent to each other,of the two heat-insulating panels 102.

Additionally, as illustrated in FIG. 8, the outer frame portion 59 a andthe coupling portion 59 b are formed with the same thickness as theheat-insulating panels 102.

In addition, when a plurality of, specifically, three or moreheat-insulating panels 102 are connected, similarly, a configuration canbe adopted in which the outer frame portion 59 a holds sides, other thansides adjacent to each other, of the plurality of heat-insulating panels102, and the coupling portion 59 b holds the sides, adjacent to eachother, of the plurality of heat-insulating panels 102.

According to this configuration, since the plurality of heat-insulatingpanels 102 can be firmly connected to each other, even if a heavy loadis placed on the heat-insulating panels 102, the strength of theheat-insulating panels 102 can be secured.

Additionally, when the plurality of heat-insulating panels 102 areconnected to each other using the connection frame 59, for example, asillustrated in FIG. 9, a configuration may be adopted in which aconnecting portion 59 c is provided between the coupling portion 59 b ofthe connection frame 59 and the substrate-supporting portions 57 of eachheat-insulating panel 102 and the coupling portion 59 b and thesubstrate-supporting portions 57 are integrally connected to each otherby the connecting portion 59 c.

In this case, a configuration may be adopted in which a hollow portion58 a is provided inside each substrate-supporting portion 57 and ahollow portion 58 c is provided inside the coupling portion 59 b. Theheat-insulating properties of the bottom part 10 having the connectionframe 59 and the heat-insulating panels 102 are enhanced by thisconfiguration.

Additionally, as illustrated in FIG. 9, a configuration may be adoptedin which the hollow portions 58 b are provided inside the connectingportion 59 c to allow the hollow portions 58 a to communicate with eachother and allow the hollow portions 58 a and the hollow portion 58 c tocommunicate with each other. Additionally, a configuration may beadopted in which the refrigerant 58 p is enclosed in the hollow portions58 a, the hollow portions 58 b, and the hollow portion 58 c thatcommunicate with each other and the refrigerant 58 p is enabled to flowthrough the hollow portions 58 a, the hollow portions 58 b, and thehollow portion 58 c.

The heat-insulating properties of the bottom part 10 having theconnection frame 59 and the heat-insulating panels 102 are furtherenhanced by this configuration.

In addition, in this case, a configuration can be adopted in which therefrigerant 58 p can be controlled so as to flow to a desired placeamong the hollow portions 58 a, the hollow portions 58 b, and the hollowportion 58 c.

For example, there is a configuration or the like in which supply unitsand recovery units for the refrigerant 58 p are provided in a pluralityof places of the hollow portions 58 a, the hollow portions 58 b, and thehollow portion 58 c, and whether to use any among the supply units andrecovery units that are provided in the plurality of places according toregions that allow the refrigerant 58 p to flow thereto is madeselectable.

Accordingly, the refrigerant 58 p can be individually supplied to aplurality of regions without being limited to one region among thehollow portions 58 a, the hollow portions 58 b, and the hollow portion58 c.

Additionally, in the above embodiment, a configuration is provided inwhich the heat generated in the heat generator HE included in theapparatus body MB of the processing apparatus PA is released from theexhaust system 62 to the outside via the temperature-adjusting gassupplied using the second supply system 64. However, the invention isnot limited to this. For example, a configuration may be adopted inwhich the heat generated in the heat generator HE is used in the heatingunit 63 b.

Specifically, as illustrated in FIG. 10, a configuration can be adoptedin which a heat transfer system 63 c is provided between the heatgenerator HE and the heating unit 63 b. The heat transfer system 63 ctransfers the heat generated in the heat generator HE to the heatingunit 63 b. As the heat transfer system 63 c, for example, aconfiguration can be adopted in which a heat pipe and a heat exchangerare combined.

Accordingly, energy saving can be achieved in a temperature adjustmentoperation of the housing section 40 of the chamber system 100.

In the above embodiment, a configuration in which thetemperature-adjusting section 60 is installed at a side wall part 20 hasbeen described as an example. However, the invention is not limited tothis. A configuration may be adopted in which the temperature-adjustingsection is installed at other portions, such as the bottom part 10 andthe ceiling part 30.

Additionally, in the above embodiment, a configuration in which theheat-insulating panels 101 are used as the heat-insulating sections 50of the side wall parts 20 and the ceiling part 30 and theheat-insulating panels 102 are used as the heat-insulating section 50 ofthe bottom part 10 has been described as an example. However, theinvention is not limited to this. A configuration may be adopted inwhich the same heat-insulating panels are used for all of the bottompart 10, the side wall parts 20, and the ceiling part 30.

In this case, for example, the heat-insulating panels 102 may be used asthe heat-insulating sections 50 of each side wall part 20 and theceiling part 30, or the heat-insulating panels 101 may be used as theheat-insulating sections 50 of the bottom part 10.

Additionally, in the above embodiment, a configuration in which oneheat-insulating panel 101 or one heat-insulating panel 102 is providedin the thickness direction in the bottom part 10, the side wall part 20,and the ceiling part 30 has been described as an example. However, theinvention is not limited to this. A configuration may be adopted inwhich a plurality of heat-insulating panels 101 or heat-insulatingpanels 102 are stacked.

This can enhance the heat-insulating properties of the bottom part 10,the side wall parts 20, and the ceiling part 30 and the strength thereofagainst an external force.

Additionally, in the above embodiment, for example, as illustrated inFIG. 1, a configuration in which the gas supply system 61 and the secondsupply system 64 supply gas from the same side (left side in FIG. 1)with respect to the processing apparatus PA has been described as anexample. The invention is not limited to this. A configuration may beadopted in which the second supply system 64 supplies gas from a sidedifferent from the gas supply system 61.

For example, in the configuration illustrated in FIG. 11, the secondsupply pipe 64 a is arranged so as to go around the processing apparatusPA, and the end portion 64 b of the second supply pipe 64 a is arranged,for example, on the right side of the processing apparatus PA.

This configuration enables gas to be sufficiently supplied also to aportion that the gas supplied from the gas supply system 61 does notreach easily. In this case, variations in temperature distributionaround the processing apparatus PA can be reduced by adjusting theposition and orientation of the end portion 64 b.

Additionally, since the temperatures of the respective sections of thechamber system 100 can be locally adjusted using the second supplysystem 64 by adjusting the position and orientation of the end portion64 b of the second supply pipe 64 a, the influence of temperaturedistribution outside the chamber system 100 is reduced.

Additionally, in the above embodiment, a configuration in which the gassupply system 61 and the second supply system 64 are provided in orderto reduce the variations in temperature distribution around theprocessing apparatus PA has been described as an example. However, theinvention is not limited to this. For example, as illustrated in FIG.11, a configuration may be adopted in which a second exhaust system 164is provided around the processing apparatus PA.

The second exhaust system 164 exhausts the gas around the processingapparatus PA to the outside of the chamber system 100. The secondexhaust system 164 has an exhaust port 164 a. The gas in the vicinity ofthe processing apparatus PA can be exhausted by arranging the exhaustport 164 a in the vicinity of the processing apparatus PA.

By virtue of such a configuration, an air current can be adjusted byexhausting the periphery of the processing apparatus PA.

Second Embodiment

Next, a second embodiment of the invention will be described.

FIG. 12 is a view illustrating the configuration of a chamber system2100 related to the present embodiment.

As illustrated in FIG. 12, the chamber system 2100 has a housing section2040 surrounded by a bottom part 2010, side wall parts 2020, and aceiling part 2030, an atmosphere-adjusting section 2050 that adjusts thetemperature of the housing section 2040, and aerialvibration-attenuating sections 2060 provided in the bottom part 2010,the side wall parts 2020, and the ceiling part 2030.

The chamber system 2100 is used after being placed, for example, on thefloor surface FL of a factory or the like.

The bottom part 2010 is placed on the floor surface FL. The bottom part2010 has a bottom plate 2010 a placed on the floor surface FL. Thebottom plate 2010 a has a configuration in which a plurality ofsound-insulating panels 2101 are arranged without gaps therebetween inthe X direction and in the Y direction. A connecting portion between thesound-insulating panels 2101 is sealed with, for example, an adhesive(not illustrated), and is fixed by a fixture (not illustrated) or thelike.

Each side wall part 2020 is formed in a state where the side wall partstands vertically with respect to the floor surface FL. The side wallpart 2020 has wall portions 2020 a surrounding four sides (+X-side,−X-side, +Y-side, and −Y-side) of the housing section 2040. Therespective wall portions 2020 a have a configuration in which theplurality of sound-insulating panels 2101 are arranged without gapstherebetween.

A connecting portion between the sound-insulating panels 2101 is sealedwith, for example, an adhesive (not illustrated), and is fixed by afixture (not illustrated) or the like. The side wall part 2020 isprovided so that two wall portions 2020 a among the four wall portions2020 a formed by the plurality of such sound-insulating panels 2101 faceeach other.

The ceiling part 2030 is provided on the +Z-side of the side wall part2020, and is arranged parallel to the floor surface FL. The ceiling part2030 has a ceiling plate 2030 a that seals the +Z-side of the housingsection 2040. The ceiling plate 2030 a has a configuration in which aplurality of sound-insulating panels 2101 are arranged without gapstherebetween in the X direction and in the Y direction.

A connecting portion between the sound-insulating panels 2101 is sealedwith, for example, an adhesive (not illustrated), and is fixed by afixture (not illustrated) or the like.

The housing section 2040 is a space that houses the processing apparatusPA. The housing section 2040 is connected to an atmosphere-adjustingsection 2050 so that, for example, the atmosphere around a processingapparatus PA can be adjusted.

The processing apparatus PA housed in the housing section 2040 includes,for example, at least one of a measuring apparatus, a manufacturingapparatus, and a machining apparatus. The number of processingapparatuses PA to be housed in the housing section 2040 may be one ormay be two or more.

The processing apparatus PA has the apparatus body MB that performsprocessing (for example, measurement processing, manufacturingprocessing, machining processing, or the like) corresponding to therespective apparatuses, and the supporting base BS that supports theapparatus body MB.

The supporting base BS is placed on the bottom part 2010 to support theapparatus body MB. Accordingly, the apparatus body MB is supported by aportion of the bottom part 2010 via the supporting base BS. A pluralityof the supporting bases BS are provided so as to support a plurality ofplaces in the apparatus body MB. In addition, the supporting base BS maybe single.

The atmosphere-adjusting section 2050 allows gas to flow between theatmosphere-adjusting section and the housing section 2040, therebyadjusting the atmosphere (for example, the temperature) inside thehousing section 2040. The atmosphere-adjusting section 2050 has a firstsupply system 2051, a second supply system 2052, and an exhaust system2053.

The first supply system 2051 supplies, for example, gas, such as air ornitrogen, to the housing section 2040. The first supply system 2051 hasa gas delivery unit 2071, a gas flow pipe 2072, and a duct 2073. The gasdelivery unit 2071 has a fan 2071 a, a fan-housing portion 2071 b, aconnecting portion 2071 c, and a sound-absorbing layer 2071 d.

The fan 2071 a is provided so as to be rotatable by the driving of, forexample, a motor device (not illustrated) and is rotated to therebydeliver the gas to the gas flow pipe 2072. The fan-housing portion 2071b is formed in a rectangular box shape, and houses the fan 2071 a. Theconnecting portion 2071 c is provided in the fan-housing portion 2071 b,and is a portion connected to the gas flow pipe 2072.

The sound-absorbing layer 2071 d is formed over the substantially entiresurface of an inner surface of the fan-housing portion 2071 b. Thesound-absorbing layer 2071 d is formed using, for example, an absorptiontype sound absorbing material, such as glass wool. The sound-absorbinglayer 2071 d absorbs sound waves inside the fan-housing portion 2071 b.

As the sound-absorbing layer 2071 d is formed, for example, motor sound,blowing sound, or the like during the rotation of the fan 2071 a isabsorbed by the sound-absorbing layer 2071 d. Therefore, noise does noteasily leak to the outside of the fan-housing portion 2071 b, and noiseis not easily transmitted to the housing section 2040 through the gasflow pipe 2072.

The gas flow pipe 2072 allows the gas delivered from the gas deliveryunit 2071 to flow to the duct 2073. The gas flow pipe 2072 has a pipingportion 2072 a formed in the shape of a tube. A first end portion 2072 bof the piping portion 2072 a on the gas delivery unit 2071 side isconnected to the connecting portion 2071 c of the gas delivery unit2071.

Accordingly, the inside of the piping portion 2072 a communicates withthe inside of the fan-housing portion 2071 b via the connecting portion2071 c. Additionally, a second end portion 2072 c of the piping portion2072 a on the duct 2073 side is connected to the duct 2073.

A sound-absorbing layer 2072 d is formed on an inner surface of thepiping portion 2072 a over its substantially entire surface. Thesound-absorbing layer 2072 d is formed using, for example, a soundabsorbing material, such as glass wool. The sound-absorbing layer 2072 dabsorbs sound waves inside the piping portion 2072 a.

As the sound-absorbing layer 2072 d is provided, for example, the flowsound or the like of the gas that flows through the piping portion 2072a is absorbed by the sound-absorbing layer 2072 d. Therefore, noise doesnot easily leak to the outside of the piping portion 2072 a.

Additionally, the piping portion 2072 a is provided with a resonantsound absorber or an interference type sound absorber that absorbs soundwaves inside the piping portion. Here, a Helmholtz sound absorber 2102that is the resonant sound absorber will be described as an example.

The duct 2073 is detachably provided in a portion of the side wall part2020. The duct 2073 delivers the gas from the gas flow pipe 2072 to thehousing section 2040. The duct 2073 has a cover member 2073 a thatcovers one surface of the side wall part 2020. The cover member 2073 ais formed in the shape of a tray so as to have dimensions correspondingto the one surface of the side wall part 2020.

The cover member 2073 a is formed with a connecting portion 2073 bconnected to the gas flow pipe 2072. The inside of the cover member 2073a and the piping portion 2072 a communicate with each other via theconnecting portion 2073 b.

The portion of the side wall part 2020 covered with the cover member2073 a is formed with a filter 2073 c. The filter 2073 c removes foreignmatter included in the gas. The inside of the cover member 2073 acommunicates with the housing section 2040 via the filter 2073 c.

A sound-absorbing layer 2073 d is formed on the inner surface of thecover member 2073 a over its substantially entire surface. Thesound-absorbing layer 2073 d is formed using, for example, a soundabsorbing material, such as glass wool.

The sound-absorbing layer 2073 d absorbs sound waves inside the covermember 2073 a. As the sound-absorbing layer 2073 d is provided, forexample, the flow sound of gas that flows in the cover member 2073 a orthe like is absorbed by the sound-absorbing layer 2073 d. Therefore,noise does not easily leak to the outside of the cover member 2073 a.

The second supply system 2052 locally supplies the gas to the processingapparatus PA. The second supply system 2052 has a gas delivery unit2081, a gas flow pipe 2082, and a silencing hose 2083. The gas deliveryunit 2081 has a fan 2081 a, a fan-housing portion 2081 b, a connectingportion 2081 c, and a sound-absorbing layer 2081 d.

The fan 2081 a is provided so as to be rotatable by the driving of, forexample, a motor device (not illustrated) and is rotated to therebydeliver the gas to the gas flow pipe 2082. The fan-housing portion 2081b is formed in a rectangular box shape, and houses the fan 2081 a. Theconnecting portion 2081 c is provided in the fan-housing portion 2081 b,and is a portion connected to the gas flow pipe 2082.

The sound-absorbing layer 2081 d is formed over the substantially entiresurface of an inner surface of the fan-housing portion 2081 b. Thesound-absorbing layer 2081 d is formed using, for example, a soundabsorbing material, such as glass wool. The sound-absorbing layer 2081 dabsorbs sound waves inside the fan-housing portion 2081 b.

As the sound-absorbing layer 2081 d is formed, for example, motor sound,blowing sound, or the like during the rotation of the fan 2081 a isabsorbed by the sound-absorbing layer 2081 d. Therefore, noise does noteasily leak to the outside of the fan-housing portion 2081 b.

The gas flow pipe 2082 allows the gas delivered from the gas deliveryunit 2081 to flow to the silencing hose 2083. The gas flow pipe 2082 hasa piping portion 2082 a formed in the shape of a tube. A first endportion 2082 b of the piping portion 2082 a on the gas delivery unit2081 side is connected to the connecting portion 2081 c of the gasdelivery unit 2081.

Accordingly, the inside of the piping portion 2082 a communicates withthe inside of the fan-housing portion 2081 b via the connecting portion2081 c. Additionally, a second end portion 2082 c of the piping portion2082 a on the silencing hose 2083 side is connected to the silencinghose 2083.

A sound-absorbing layer 2082 d is formed on an inner surface of thepiping portion 2082 a over its substantially entire surface. Thesound-absorbing layer 2082 d is formed using, for example, a soundabsorbing material, such as glass wool. The sound-absorbing layer 2082 dabsorbs sound waves inside the piping portion 2082 a.

As the sound-absorbing layer 2082 d is provided, for example, the flowsound or the like of the gas that flows through the piping portion 2082a is absorbed by the sound-absorbing layer 2082 d. Therefore, noise doesnot easily leak to the outside of the piping portion 2082 a.

The silencing hose 2083 locally jets the gas from the gas flow pipe 2082to the processing apparatus PA. The silencing hose 2083 has an adapter2083 a provided in the side wall part 2020, a hose body 2083 b arrangedinside the housing section 2040, and a nozzle 2083 c provided at the tipof the hose body 2083 b.

The adapter 2083 a has the piping portion 2082 a of the gas flow pipe2082 detachably connected thereto from an outer surface side of the sidewall part 2020 and has the hose body 2083 b detachably connected theretofrom an inner surface side (housing section 2040 side) of the side wallpart 2020.

The adapter 2083 a communicates with the inside of the hose body 2083 band the inside of the piping portion 2082 a in a state where the hosebody 2083 b and the piping portion 2082 a are connected to each other.In addition, a sound-absorbing layer (not illustrated) is formed on aninner surface of the adapter 2083 a over its substantially entiresurface.

The hose body 2083 b is formed so as to extend from the adapter 2083 atoward the processing apparatus PA. The hose body 2083 b guides the gasfrom the adapter 2083 a to the processing apparatus PA. The nozzle 2083c is directed to a heat generator HT of the processing apparatus PA, andis able to locally supply the gas to the heat generator HT included inthe apparatus body MB.

In addition, it is possible to adjust the position or orientation of thenozzle 2083 c, thereby locally supplying the gas to a portion differentfrom the heat generator HT. For example, a configuration may be adoptedin which the nozzle 2083 c is arranged at a portion between a pluralityof the supporting bases BS, outside the apparatus body MB, or the liketo thereby supply the gas to these portions.

Since the portion between the supporting bases BS or the portion of theapparatus body MB on the +X-side is located on the downstream side of aflow of the gas supplied from the first supply system 2051, drift mayoccur or particles or the like of the housing section 2040 may bedeposited. The occurrence of drift or the deposition of particles isreduced by locally supplying the gas to such a portion.

Additionally, a configuration may be adopted in which a plurality of thehose bodies 2083 b and the nozzles 2083 c are provided. In this case,the gas can be locally supplied to a plurality of places.

The gas supplied to the heat generator HT adjusts the temperature of aspace around the heat generator HT. In addition, the gas used for thetemperature adjustment is released to the outside (that is, the housingsection 2040) of the processing apparatus PA from an exhaust part (notillustrated) provided in the processing apparatus PA, and is exhaustedto the outside of the housing section 2040 by the exhaust system 2053.

In this way, by providing the second supply system 2052 that locallysupplies the gas to the heat generator HT of the processing apparatusPA, unevenness, drift, or the like of a flow of the gas that is suppliedby, for example, the first supply system 2051 is reduced, and depositionof particles in the vicinity of the processing apparatus PA (forexample, between the supporting bases BS or the like) is reduced.

The aerial vibration-attenuating sections 2060 attenuate the aerialvibration from the outside of the housing section 2040. The aerialvibration-attenuating section 2060 is provided in each of the bottompart 2010, the side wall parts 2020, the ceiling part 2030, and theatmosphere-adjusting section 2050.

In the present embodiment, the sound-insulating panels 2101 thatconstitute the bottom part 2010, the side wall parts 2020, and theceiling part 2030 are provided as one form of the aerialvibration-attenuating sections 2060.

Additionally, in the present embodiment, the Helmholtz sound absorber2102, the sound-absorbing layer 2071 d, the sound-absorbing layer 2072d, the sound-absorbing layer 2073 d, the sound-absorbing layer 2081 d,and the sound-absorbing layer 2082 d in the atmosphere-adjusting section2050 are used as one form of the aerial vibration-attenuating sections2060.

FIG. 13 is a cross-sectional view illustrating the configuration of asound-insulating panel 2101.

As illustrated in FIG. 13, the sound-insulating panel 2101 has a baseportion 2061, a lid portion 2062, and a communication portion 2063. Thesound-insulating panel 2101 is formed so as to resonate with the aerialvibration by generating Helmholtz resonance. The base portion 2061 andthe lid portion 2062 are formed using, for example, metal.

The base portion 2061 has a bottom portion 2061 a and a wall portion2061 b. The bottom portion 2061 a is formed in a rectangular shape. Thewall portion 2061 b is provided on four sides of the bottom portion 2061a, and is formed so as to surround a central portion of the bottomportion 2061 a in a plan view.

The bottom portion 2061 a and the wall portion 2061 b are formed of, forexample, one member. A recess 2061 c is formed in a portion surroundedby the bottom portion 2061 a and the wall portion 2061 b.

The lid portion 2062 is formed in a rectangular plate shape, similar tothe bottom portion 2061 a of the base portion 2061, and is formed withsubstantially the same dimensions as the bottom portion 2061 a. The lidportion 2062 is placed on the wall portion 2061 b so as to block therecess 2061 c and cover the base portion 2061. The wall portion 2061 band the lid portion 2062 are brought into close contact with each otherby, for example, an adhesive (not illustrated).

A communication portion 2063 is formed in the lid portion 2062. Thecommunication portion 2063 is formed through the lid portion 2062 in itsthickness direction. The communication portion 2063 communicates withthe inside of the recess 2061 c and the outside of the recess 2061 c.

In the present embodiment, the communication portion 2063 is provided onthe side of the sound-insulating panel 2101 inside the housing section2040. For this reason, the communication portion 2063 communicates withthe inside of the recess 2061 c and the inside of the housing section2040.

FIG. 14 is an explanatory view illustrating the Helmholtz resonance ofthe sound-insulating panel 2101, and is a schematic view illustrating aHelmholtz resonator.

The Helmholtz resonator in which a neck portion is connected to a spaceportion is illustrated in FIG. 14. In this Helmholtz resonator, a springmass system in which the air in the space portion acts as a spring andthe air in the neck portion acts as mass is conceivable. In this case,if sonic velocity is c, the volume of the space portion is V, the lengthof the neck portion is defined as L, and the cross-sectional area of theneck portion is defined as S, the resonant frequency f of the Helmholtzresonance is expressed by the following Expression 1.

$\begin{matrix}{\left\lbrack {{Expression}\mspace{14mu} 1} \right\rbrack \mspace{619mu}} & \; \\{f = {\frac{c}{2\pi}\sqrt{\frac{S}{VL}}}} & \;\end{matrix}$

That is, when the same periodic external force as the frequency f isapplied to the Helmholtz resonator from the outside, that is, whenaerial vibration with the frequency f is transmitted, the air within theHelmholtz resonator vibrates.

This is the principle of the Helmholtz resonance. The energy of theaerial vibration with the frequency f is consumed by a frictional forcegenerated when the air inside the Helmholtz resonator vibrates or thelike, and as a result, the amplitude of the aerial vibration decreases.That is, the aerial vibration with the same frequency as the resonantfrequency f is attenuated by the Helmholtz resonator.

A space 2066 formed as the recess 2061 c is blocked by the lid portion2062 functions as the space portion of the Helmholtz resonator, and thecommunication portion 2063 formed in the lid portion 2062 functions asthe neck portion of the Helmholtz resonator, whereby thesound-insulating panel 2101 functions as the Helmholtz resonator.

In the above Expression 1, the volume V of the space portion of theHelmholtz resonator, the length L of the neck portion, and thecross-sectional area S of the neck portion become variables. For thisreason, a Helmholtz resonator having an arbitrary resonant frequency fcan be configured by adjusting these variables.

That is, in the present embodiment, at least one out of the space 2066(volume V) and the communication portion 2063 (length L, cross-sectionalarea S) having a specification according to the frequency F of aerialvibration to be attenuated are obtained, whereby the sound-insulatingpanel 2101 has a resonant frequency corresponding to the frequency F ofthe above aerial vibration.

FIG. 15 is a view illustrating the configuration of the Helmholtz soundabsorber 2102. In addition, FIG. 15 illustrates a state where theHelmholtz sound absorber 2102 is cut into halves in order to makeillustration easily understood.

As illustrated in FIG. 15, the Helmholtz sound absorber 2102 has abox-shaped member 2102 a for forming a cavity portion 2102 b around thegas flow pipe 2072. The portion of the gas flow pipe 2072 surrounded bythe box-shaped member 2102 a is formed with through-holes 2072 e. Thethrough-holes 2072 e are formed so as to allow the inside and outside ofthe piping portion 2072 a to communicate with each other.

Accordingly, the inside of the piping portion 2072 a communicates withthe cavity portion 2102 b via the through-holes 2072 e.

FIG. 16 is a view schematically illustrating the Helmholtz soundabsorber 2102.

As illustrated in FIG. 16, in the Helmholtz sound absorber 2102, whenthe volume of the cavity portion 2102 b is defined as V, thecross-sectional area of the piping portion 2072 a is defined as S, thediameter of the piping portion 2072 a is defined as d, the thickness ofthe piping portion 2072 a, that is, the length of the through-holes 2072e, is defined as Lc, and the radius of the through-holes 2072 e isdefined as a (the diameter thereof is 2a), the acoustic loss TL (dB) inthe Helmholtz sound absorber 2102 and the central frequency Fr (Hz) ofthe aerial vibration are shown by Equation (1) and Equation (2) ofExpression 2.

However, it is premised that Equation (1) and Equation (2) satisfyEquation (3) and Equation (4).

$\begin{matrix}{\left\lbrack {{Expression}\mspace{14mu} 2} \right\rbrack \mspace{490mu}} & \; \\{{{Acoustic}\mspace{14mu} {Loss}\mspace{14mu} T\; L\mspace{14mu} ({dB})}{{TL} = {10 \times \log_{10}\left\{ {1 + \frac{\left( \frac{\sqrt{\left( {{Co} \times V} \right.}}{2 \times S} \right)^{2}}{\left( {\frac{F}{Fr} - \frac{Fr}{F}} \right)^{2}}} \right\}}}} & {{Equation}\mspace{14mu} (1)} \\{{{Central}\mspace{14mu} {Frequency}\mspace{14mu} {Fr}\mspace{14mu} ({Hz})}{{Fr} = {\frac{c}{2 \times \pi} \times \sqrt{\frac{Co}{V}}}}{{Here},}} & {{Equation}\mspace{14mu} (2)} \\{{Co} = {n\; \pi \; {a^{2}/\left( {{Lc} + {\beta \; a}} \right)}}} & {{Equation}\mspace{14mu} (3)} \\{\beta = {\pi/2}} & {{Equation}\mspace{14mu} (4)}\end{matrix}$

FIG. 17 is a cross-sectional view illustrating the configuration of thesilencing hose 2083.

As illustrated in FIG. 17, the silencing hose 2083 has a metal wire 2091formed in a spiral shape, a nonwoven fabric member 2092 wound around theoutside of the metal wire 2091, a glass wool layer 2093 that covers anouter periphery of the nonwoven fabric member 2092, and a tube member2094 that covers the glass wool layer 2093.

The silencing hose 2083 is formed so that the gas flows through theinside of the metal wire 2091 surrounded by the nonwoven fabric member2092. The silencing hose 2083 absorbs the flow of the gas and the noisepropagated by the gas, and suppresses the movement of heat between theinside and outside thereof. For this reason, the movement of heatbetween the housing section 2040 and the silencing hose 2083 of thechamber system 2100 is suppressed.

In the above configuration, the aerial vibration-attenuating sections2060 (sound-insulating panels 2101) are arranged on the entire surfaceof an outer wall portion including the bottom part 2010, the side wallparts 2020, and the ceiling part 2030, which surrounds the housingsection 2040. Therefore, the housing section 2040 is isolated from theoutside in the state of being surrounded by the aerialvibration-attenuating sections 2060.

For this reason, the state between the inside and outside of the housingsection 2040, also including the bottom part 2010, is brought into astate where the transmission of vibration caused by noise is regulated.

Additionally, the sound-absorbing layer is formed as each aerialvibration-attenuating section 2060 over the substantially entire surfaceof the inner surface of each of the portions that constitute theatmosphere-adjusting section 2050, the Helmholtz sound absorber 2102 isprovided as the aerial vibration-attenuating section 2060 in the gasflow pipe 2072, and the silencing hose 2083 is provided as the aerialvibration-attenuating section 2060 in the second supply system 2052.Therefore, the state between the atmosphere-adjusting section 2050 andthe outside thereof is also brought into a state where the transmissionof vibration caused by noise is regulated.

As described above, the chamber system 2100 related to the presentembodiment includes the housing section 2040 that is surrounded by thebottom part 2010, the side wall parts 2020, and the ceiling part 2030and houses the processing apparatus PA, the atmosphere-adjusting section2050 that adjusts the atmosphere inside the housing section 2040, andthe aerial vibration-attenuating sections 2060 that are provided at thebottom part 2010, the side wall parts 2020, the ceiling part 2030, andthe atmosphere-adjusting section 2050, and attenuate the aerialvibration outside the housing section 2040. Thus, the transfer of heatbetween the inside and outside of the housing section can be regulatednot only in the bottom part 2010, the side wall parts 2020 and theceiling part 2030 but also the atmosphere-adjusting section 2050.

Accordingly, it is possible to reduce the transmission of vibrationcaused by sound occurring inside and outside the chamber system 2100. Inthis way, the chamber system 2100 having excellent sound-insulatingproperties can be provided.

Third Embodiment

Next, a third embodiment of the invention will be described.

FIG. 18 is a view illustrating the configuration of a chamber system2200 related to the present embodiment.

The chamber system 2200 of the present embodiment is different from thatof the second embodiment in terms of the configuration of a first supplysystem 2251 of an atmosphere-adjusting section 2250, and otherconfigurations thereof are the same as that of the second embodiment.Hereinafter, differences from the second embodiment will mainly bedescribed.

As illustrated in FIG. 18, the first supply system 2251 has a gasdelivery unit 2271, a gas flow pipe 2272, and a duct 2273. Among these,the gas flow pipe 2272 is bent in an L-shape, and an elbow soundabsorber 2103 is provided at the bent portion of the gas flow pipe 2272.The elbow sound absorber 2103 is arranged on the gas delivery unit 2271side with respect to the Helmholtz sound absorber 2102.

In this way, according to the present embodiment, the elbow soundabsorber 2103 is provided in addition to the Helmholtz sound absorber2102. Thus, the sound generated in the first supply system 2251 isabsorbed. Accordingly, transmission of vibration resulting from theoutside of the first supply system 2251, that is, sound, to the housingsection 2040 side can be reduced.

Fourth Embodiment

Next, a fourth embodiment of the invention will be described.

FIG. 19 is a view illustrating the configuration of a chamber system2300 related to the present embodiment.

The chamber system 2300 of the present embodiment is different from thatof the first embodiment in terms of the configuration of a first supplysystem 2351 of an atmosphere-adjusting section 2350, and otherconfigurations thereof are the same as that of the second embodiment.Hereinafter, differences from the second embodiment will mainly bedescribed.

As illustrated in FIG. 19, the first supply system 2351 has a duct 2373and a duct 2374 that are arranged side by side in a Z direction. Theduct 2373 and the duct 2374 are spatially shut off from each other. Forthis reason, the duct 2373 and the duct 2374 individually have internalspaces that are independent from each other.

The duct 2373 and the duct 2374 have cover members 2373 a and 2374 a,connecting portions 2373 b and 2374 b, filters 2373 c and 2374 c, andsound-absorbing layers 2373 d and 2374 d, respectively. Theconfigurations are the same as those of the second embodiment.

A first branch pipe 2375 and a second branch pipe 2376 that are branchpipes are connected to a second end portion 2372 c of a gas flow pipe2372. The first branch pipe 2375 has a piping portion 2375 a formed inthe shape of a tube, and a sound-absorbing layer 2375 d formed over thesubstantially entire surface of an inner surface of the piping portion2375 a. The first branch pipe 2375 is connected to the connectingportion 2373 b of the duct 2373.

Similarly, the second branch pipe 2376 has a piping portion 2376 aformed in the shape of a tube, and a sound-absorbing layer 2376 d formedover the substantially entire surface of an inner surface of the pipingportion 2376 a. Additionally, the second branch pipe 2376 is connectedto the connecting portion 2374 b of the duct 2374.

Since the duct 2373 and the duct 2374 are shut off from each other, thegas that has flowed through the first branch pipe 2375, and the gas thathas flowed through the second branch pipe 2376 are individually suppliedto the housing section 2040 without being mixed with each other.

In addition, in the first supply system 2351, the gas flow pipe 2372 isformed in an L-shape, similar to the third embodiment. Additionally, theelbow sound absorber 2103 is provided at a bent portion of the gas flowpipe 2372.

In the present embodiment, the elbow sound absorber 2103 is provided inaddition to the Helmholtz sound absorber 2102, the sound-absorbing layer2375 d and the sound-absorbing layer 2376 d are formed over thesubstantially entire surfaces of the inner surfaces of the first branchpipe 2375 and the second branch pipe 2376 that branch from each other,and the sound-absorbing layer 2373 d and the sound-absorbing layer 2374d are formed over the substantially entire surfaces of the innersurfaces of the duct 2373 and the duct 2374 that are individuallyprovided. Therefore, the sound generated in the first supply system 2351is absorbed.

Accordingly, transmission of vibration resulting from the outside of thefirst supply system 2351, that is, sound, to the housing section 2040side can be reduced.

In addition, in the present embodiment, a configuration in which thefirst branch pipe 2375 and the second branch pipe 2376 have the samepath length has been described as an example. However, the invention isnot limited to this. A configuration may be adopted in which the firstbranch pipe 2375 and the second branch pipe 2376 are formed so as tohave different path lengths.

In this case, for example, if the wavelength of vibration generated inthe gas delivery unit 2371 is defined as λ, the interference betweenwaves of which the phases are shifted from each other by λ/2 is causedby shifting a path length by λ/2 between the first branch pipe 2375 andthe second branch pipe 2376. This interference can attenuate thevibration generated in the atmosphere-adjusting section 2350.

Fifth Embodiment

Next, a fifth embodiment of the invention will be described.

FIG. 20 is a view illustrating the configuration of a chamber system2400 related to the present embodiment.

The chamber system 2400 of the present embodiment is different from thatof the second embodiment in terms of the configuration of a first supplysystem 2451 of an atmosphere-adjusting section 2450, and otherconfigurations thereof are the same as that of the second embodiment.Hereinafter, differences from the second embodiment will mainly bedescribed.

As illustrated in FIG. 20, the first supply system 2451, similar to thefourth embodiment, has a duct 2473 and a duct 2474 that are arrangedside by side in the Z direction.

The duct 2473 and the duct 2474 have cover members 2473 a and 2474 a,connecting portions 2473 b and 2474 b, filters 2473 c and 2474 c, andsound-absorbing layers 2473 d and 2474 d, respectively. The respectiveconfigurations are the same as those of the fourth embodiment.

A manifold 2104 is connected to a second end portion 2472 c of the gasflow pipe 2472. The manifold 2104 has a container member 2104 a capableof containing gas, a connecting portion 2104 b, a branch connectingportion 2104 c, and a sound-absorbing layer 2104 d.

The connecting portion 2104 b is provided on a gas delivery unit 2471side (an upstream side of the flow of the gas) of the container member2104 a. A plurality of the branch connecting portions 2104 c areprovided on the side (a downstream side of the flow of the gas) of theduct 2473 and the duct 2474 of the container member 2104 a.Additionally, the sound-absorbing layer 2104 d is formed over thesubstantially entire surface of an inner surface of the container member2104 a.

Silencing hoses 2105 are connected to the plurality of branch connectingportions 2104 c. The configuration of the silencing hoses 2105 is thesame as that of the silencing hose 2083 of the first embodiment. Some ofthe plurality of silencing hoses 2105 are connected to the connectingportion 2473 b of the duct 2473. Additionally, the rest of the pluralityof silencing hoses 2105 are connected to the connecting portion 2474 bof the duct 2474.

In this way, the present embodiment provides a configuration in whichthe downstream side of the gas flow pipe 2472 is branched using themanifold 2104 and the silencing hoses 2105.

According to the present embodiment, the sound-absorbing layer 2104 dand the sound-absorbing layer 2474 d are formed as the aerialvibration-attenuating sections 2060 and are formed over thesubstantially entire surface of the inner surface of the manifold 2104,and the sound-absorbing layer 2473 d and the sound-absorbing layer 2474d are formed as the aerial vibration-attenuating sections 2060 over thesubstantially entire surfaces of the inner surfaces of the duct 2473 andthe duct 2474 that are individually provided. Therefore, the soundgenerated in the first supply system 2451 is easily absorbed.

Accordingly, transmission of vibration resulting from the outside of thefirst supply system 2451, that is, sound, to the housing section 2040side can be reduced.

Sixth Embodiment

Next, a sixth embodiment of the invention will be described.

FIG. 21 is a view illustrating the configuration of a chamber system2500 related to the present embodiment.

The chamber system 2500 of the present embodiment is different from thatof the second embodiment in terms of the configuration of anatmosphere-adjusting section 2550, and other configurations thereof arethe same as that of the second embodiment. Hereinafter, differences fromthe second embodiment will mainly be described.

As illustrated in FIG. 21, the atmosphere-adjusting section 2550 has agas supply system 2551 and an exhaust system 2552. The gas supply system2551 has a gas delivery unit 2571, a gas flow pipe 2572, and a duct2573. The configuration of the present embodiment is different from theconfiguration of the above respective embodiments in that the gas flowpipe 2572 is configured using a plurality of silencing hoses.

Additionally, the exhaust system 2552 exhausts the gas of the housingsection 2040 to the outside of the housing section 2040. The exhaustsystem 2552 has a piping portion 2552 a. The piping portion 2552 a hasone end connected to a connecting portion 2020 b of each side wall part2020 and the other end connected to a circulation connecting portion2571 c of the gas delivery unit 2571.

For this reason, the piping portion 2552 a allows the gas exhausted fromthe connecting portion 2020 b to flow to the gas delivery unit 2571. Asound-absorbing layer 2552 b is formed on an inner surface of the pipingportion 2552 a over its substantially entire surface.

In addition, sound-absorbing layers formed with the same configurationas the above embodiment are arranged as the aerial vibration-attenuatingsections 2060 over the substantially entire surfaces of the innersurfaces of the circulation connecting portion 2571 c and the connectingportion 2020 b.

Additionally, the elbow sound absorber 2103, the Helmholtz soundabsorber 2102, and a splitter sound absorber 2106 are provided as theaerial vibration-attenuating sections 2060 from the connecting portion2020 b side toward the circulation connecting portion 2571 c side in thepiping portion 2552 a. The Helmholtz sound absorber 2102 and thesplitter sound absorber 2106 are provided at close positions.

When the gas exhausted from the housing section 2040 is circulatedthrough the gas delivery unit 2571 as in the present embodiment,vibration caused by sound propagates in a direction opposite to adirection in which the gas flows, in a circulation path. Accordingly,the sound generated in the gas delivery unit 2571 propagates to thepiping portion 2552 a via the circulation connecting portion 2571 c, andproceeds to the connecting portion 2020 b side within the piping portion2552 a.

In this process, for example, the sound is absorbed in order by thesound-absorbing layer 2571 e provided on the inner surface of the gasdelivery unit 2571, the sound-absorbing layer 2552 b provided on theinner surface of the piping portion 2552 a, the splitter sound absorber2106, the Helmholtz sound absorber 2102, and the elbow sound absorber2103. This can reduce transmission of the sound generated in the gasdelivery unit 2571 to the housing section 2040.

In addition, in the present embodiment, the Helmholtz sound absorber2102 and the splitter sound absorber 2106 are provided at positionsclose to each other. However, these sound absorbers are not necessarilyprovided close to each other.

Seventh Embodiment

Next, a seventh embodiment of the invention will be described.

FIG. 22 is a view illustrating the configuration of a chamber system2600 related to the present embodiment.

The chamber system 2600 of the present embodiment is different from thesixth embodiment in terms of the configuration of an exhaust system 2652of an atmosphere-adjusting section 2650 and the configuration of theaerial vibration-attenuating sections 2060, and other configurationsthereof are the same as that of the sixth embodiment. Hereinafter,differences from the second embodiment will mainly be described.

As illustrated in FIG. 22, the exhaust system 2652 has a piping portion2652 a that exhausts the gas of the housing section 2040 to the outsideof the housing section 2040. Additionally, the exhaust system 2652 has agas delivery unit 2682 that delivers the gas to the piping portion 2652a. The gas delivery unit 2682 is connected to the connecting portion2020 b of the side wall part 2020 by an exhaust pipe 2681.

Accordingly, the gas delivery unit 2682 communicates with the housingsection 2040 via the exhaust pipe 2681 and the connecting portion 2020b.

The gas delivery unit 2682 has a fan 2682 a that delivers gas byrotation, and a fan-housing portion 2682 b that houses the fan 2682 a.The fan-housing portion 2682 b is provided with a first connectingportion 2682 c connected to the exhaust pipe 2681 and a secondconnecting portion 2682 d connected to the piping portion 2652 a.

Additionally, a sound-absorbing layer 2682 e is provided as the aerialvibration-attenuating section 2060 on the inner surface of thefan-housing portion 2682 b over its substantially entire surface.

Additionally, the elbow sound absorber 2103 and an active sound absorber2107 are provided from the connecting portion 2020 b side toward acirculation connecting portion 2671 c side in the piping portion 2652 a.The active sound absorber 2107 detects the acoustic frequency in thehousing section 2040, and attenuates sound with a predeterminedfrequency that influences the processing apparatus PA in the pipingportion 2652 a, using a superposition principle.

The active sound absorber 2107 has a housing 2107 a, a detectingmicrophone 2107 b provided in the housing section 2040, a microphone2107 c for a housing and a loudspeaker 2107 d that are provided insidethe housing 2107 a, and a controller 2107 e that generally controls therespective portions. The detecting microphone 2107 b is provided in thevicinity of, for example, the processing apparatus PA.

The active sound absorber 2107 detects the distribution of the acousticfrequency in the vicinity of the processing apparatus PA with thedetecting microphone 2107 b, and transmits the distribution to thecontroller 2107 e.

In order to attenuate a waveform with a predetermined frequency thatinfluences the processing apparatus PA among detection results obtainedby the detecting microphone 2107 b, a waveform for this attenuation isgenerated in the controller 2107 e. The waveform generated in thecontroller 2107 e is output as a sound signal from the loudspeaker 2107d.

At this time, a feedback control may be performed such that the acousticfrequency inside the housing 2107 a is detected using the microphone2107 c for a housing inside the housing 2107 a, the detection result istransmitted to the controller 2107 e, and an output signal made tooutput from the loudspeaker 2107 d on the basis of the detection resultof the microphone 2107 c for a housing is generated in the controller2107 e.

As described above, according to the present embodiment, the acousticfrequency within the housing section 2040 can be attenuated in thepiping portion 2652 a by using the active sound absorber 2107 for thepiping portion 2652 a of the exhaust system 2652. This can prevent aninfluence on the processing apparatus PA.

The technical range of the invention is not limited to the aboveembodiment, and, changes can be appropriately added without departingfrom the scope of the invention.

For example, in the above embodiment, a configuration in which the space2066 formed by the recess 2061 c and the lid portion 2062 as thesound-insulating panel 2101 is one layer has been described as anexample. However, the invention is not limited to this. For example, aconfiguration in which the space is divided into a plurality of layersmay be adopted.

For example, as illustrated in FIG. 23, a configuration may be adoptedin which a portion between the recess 2061 c and the lid portion 2062 isdivided into a three-layer space (spaces 2066A, 2066B, and 2066C) by ametal membrane 2064 and a metal membrane 2065.

The metal membrane 2064 and the metal membrane 2065 are formed of, forexample, aluminum or the like. The metal membrane 2064 and the metalmembrane 2065 are respectively formed with a through-hole 2064 a and athrough-hole 2065 a that pass through both surfaces thereof.

Additionally, in the configuration illustrated in FIG. 23, a pluralityof the communication portions 2063 formed in the lid portion 2062 areprovided. The band of the frequency at which sound can be absorbed canbe broadened compared to a case where the space is one layer by virtueof the configuration having the plurality of layers of spaces in thisway.

Additionally, as illustrated in FIG. 24, a configuration may be adoptedin which a lid portion-supporting portion 2067 supporting the lidportion 2062 is provided inside the space 2066.

The lid portion-supporting portion 2067 is formed using, for example, ahigh-rigidity material, such as metal. The lid portion-supportingportion 2067 is formed, for example, in a columnar shape, and is housedin the space 2066. The lid portion-supporting portion 2067 has an upperend abutting against the lid portion 2062 and a lower end supported bythe bottom portion 2061 a. This configuration can make it hard for thelid portion 2062 to be deflected to the space 2066 side.

Additionally, for example, in the above respective embodiments, anexample in which the bottom part 2010, the side wall parts 2020, and theceiling part 2030 are constituted by the sound-insulating panels 2101has been illustrated and described. However, the invention is notlimited to this. For example, as illustrated in FIG. 25, the bottom part2010, the side wall parts 2020, and the ceiling part 2030 may beconstituted using heat-insulating panels 2201 in addition to thesound-insulating panels 2101.

Although a configuration in which a sound-insulating panel 2101 isarranged on a heat-insulating panel 2201 has been described as anexample in FIG. 25, the invention is not limited to this. Aconfiguration may be adopted in which a heat-insulating panel 2201 isarranged on a sound-insulating panel 2101.

The heat-insulating panel 2201 has a pair of substrates (a firstsubstrate 2191 and a second substrate 2192), a heat transfer-suppressinglayer 2193 sandwiched by the first substrate 2191 and the secondsubstrate 2192, and a reinforcing member 2194 that reinforces the firstsubstrate 2191 and the second substrate 2192.

As the first substrate 2191 and the second substrate 2192, for example,a substrate formed of a resin material, such as plastics, a substrateformed of a metallic material, such as stainless steel, or the like canbe used. A configuration may be adopted in which heat is reflected byproviding copper foil, aluminum foil, or the like on the front surfacesor inner surfaces of the first substrate 2191 and the second substrate2192.

The heat transfer-suppressing layer 2193 includes a heat-insulatingmaterial layer or a vacuum layer that suppresses the transfer of heat.As the heat-insulating material layer, for example, a configurationobtained using foamed urethane or the like may be adopted. As the vacuumlayer, for example, a configuration may be adopted in which a spacebetween the first substrate 2191 and the second substrate 2192 is sealedso as to have a pressure of about 10⁻³ Pa.

Additionally, as the heat transfer-suppressing layer 2193, aconfiguration may be adopted in which a heat-insulating material layerformed of a fiber-based core material, such as a glass fiber, and avacuum layer sealed so that the pressure thereof becomes about 1 Pa to10 Pa are included.

The reinforcing member 2194 has a first reinforcing substrate 2195 thatreinforces the first substrate 2191, a second reinforcing substrate 2196that reinforces the second substrate 2192, and a substrate-supportingportion 2197 that supports the first reinforcing substrate 2195 and thesecond reinforcing substrate 2196. The first reinforcing substrate 2195,the second reinforcing substrate 2196, and the substrate-supportingportion 2197 are formed of, for example, a metallic material.

By using the heat-insulating panel 2201 in this way, the movement ofheat between the inside and the outside of the housing section 2040 canbe prevented, and the influence exerted on the processing apparatus PAcan be reduced.

Additionally, there is a great necessity for a configuration in whichthe first substrate 2191, the second substrate 2192, and the heattransfer-suppressing layer 2193 that constitute each heat-insulatingpanel 2201 are not easily deformed against the load of thesound-insulating panel 2101 in a thickness direction (a directiondirected from the first substrate 2191 to the second substrate 2192).

In contrast, in the present embodiment, the heat-insulating panel 2201provided on the bottom part 2010 has the first reinforcing substrate2195, the second reinforcing substrate 2196, and thesubstrate-supporting portions 2197. Therefore, the first substrate 2191,the second substrate 2192, and the heat transfer-suppressing layer 2193are configured so as not to be easily deformed against the load of theheat-insulating panel 2201 in the thickness direction.

In addition, although the configuration in the bottom part 2010 has beendescribed as an example in FIG. 25, the above configuration may be usedfor the side wall parts 2020 and the ceiling part 2030 in addition tothe bottom part. Additionally, a configuration may be adopted in whichthe first substrate 2191, the second substrate 2192, and the heattransfer-suppressing layer 2193 are included without providing theheat-insulating panel 2201 with the reinforcing member 2194.

Additionally, in the above embodiment, a configuration in which thesound-insulating panels 2101 are used as the side wall parts 2020 andthe ceiling part 2030 of the chamber system 2100 has been described asan example. However, the invention is not limited to this. Asillustrated in FIG. 26, a configuration may be adopted in which a soundabsorbing material 2108 is provided, for example, on the inner surface(surface on the housing section 2040 side) of the heat-insulating panel2201 as the side wall parts 2020 and the ceiling part 2030.

As the sound absorbing material 2108, for example, an ULPA (Ultra LowPenetration Air) filter is used. In addition, a porous material may beused as the sound absorbing material 2108.

By using a chemically clean sound absorbing material, such as the ULPAfilter, as a sound absorbing material 2108, the sound absorbing material2108 can also be arranged in a chemically clean environment as anenvironment where the chamber system 2100 is provided, unlike, forexample, the sound absorbing material, such as the glass wool.

Additionally, a configuration in which the sound absorbing material 2108and the sound-insulating panel 2101 described in the above embodimentare combined together may be adopted for the side wall parts 2020 andthe ceiling part 2030. As such a configuration, for example, there is aconfiguration in which the sound absorbing material is pasted on thesurface of the sound-insulating panel 2101, for example, in theheat-insulating panel 2201 and the sound-insulating panel 2101 that areillustrated in FIG. 25.

Additionally, for example, as illustrated in FIG. 27, a configurationmay be adopted in which the sound absorbing material 2108 is providednot only on the surface of the lid portion 2062 of the sound-insulatingpanel 2101 but inside the recess 2061 c.

By providing the sound absorbing material 2108 inside the recess 2061 c,it is possible to further enhance sound absorbing properties.Additionally, by integrating the heat-insulating panel 2201, thesound-insulating panel 2101, and the sound absorbing material 2108, therigidity of the side wall parts 2020 and the ceiling part 2030 can beenhanced, and it is possible to suppress occurrence of noise caused byvibration.

FIGS. 28 and 29 are graphs illustrating results obtained by performingacoustic analysis using the finite element method when a sound pressurespectrum is input from a portion of a side wall part 2020, in a casewhere the chamber system 2100 is formed as a rectangular parallelepiped.In addition, the inner surface and outer surface of the side wall part2020 of the chamber system 2100 are formed as rigid body surfaces.

FIG. 28 illustrates the state of vibration when the inner surfaces ofthe side wall parts 2020 and the ceiling part 2030 are not provided withthe sound absorbing materials 2108. FIG. 29 illustrates the state ofvibration when the inner surfaces of the side wall parts 2020 and theceiling part 2030 are provided with the sound absorbing materials 2108.The horizontal axis of FIGS. 28 and 29 shows the frequency (relativevalue) of the vibration, and the vertical axis shows the amplitude(relative value) of the vibration.

FIG. 29 illustrates results when the sound absorbing materials 2108 witha reflectivity 0.5 are pasted on the ceiling part 2030, the four sidesurfaces of the side wall parts 2020, and the bottom part 2010. Inaddition, the places where the acoustic analysis was performed are fivepoints in the housing section 2040.

As illustrated in FIGS. 28 and 29, when the sound absorbing materials2108 including the ULPA filters are provided on the inner surfaces ofthe side wall parts 2020 and the ceiling part 2030, it can be seen thatthe amplitude of the vibration in the housing section 2040 is lowercompared to a case where the sound absorbing material 2108 is notprovided on the inner surface.

By providing the sound absorbing material 2108 on the inner surface ofeach of the side wall part 2020 and the ceiling part 2030 in this way,it is possible to enhance the sound absorbing properties of the housingsection 2040.

In the above embodiment, for the chamber system 2100, a configuration inwhich the bottom part 2010 and the ceiling part 2030 are parallel toeach other and opposing side wall parts 2020 are parallel to each otherhas been described as an example. However, the invention is not limitedto this. It is also possible to adopt a configuration in which thebottom part 2010 and the ceiling part 2030 are not parallel to eachother and the opposing side wall parts 2020 are not parallel to eachother.

For example, as illustrated in FIG. 30, a configuration may be adoptedin which a plurality of irregular portions (protrusions 2020 d andrecesses 2020 e) are provided in the opposing side wall parts 2020. Inthis configuration, between the opposing side wall parts 2020, theprotrusions 2020 d face each other and the recesses 2020 e face eachother. Therefore, there is a configuration in which the opposing sidewall parts 2020 do not become parallel to each other.

In addition, the shape of the protrusions 2020 d and the recesses 2020 emay be other shapes (for example, a quadrangular shape, a semicircularshape, a semi-spherical shape, and the like) without being limited to atriangular shape as illustrated in FIG. 30.

Additionally, although the protrusions 2020 d and the recesses 2020 eare provided in a range from the bottom part 2010 to the ceiling part2030, the invention is not limited to that in FIG. 30. Additionally, aconfiguration may be adopted in which the same structure as theprotrusions 2020 d and the recesses 2020 e is provided in the bottompart 2010 or the ceiling part 2030.

Additionally, for example, as illustrated in FIG. 31, a configurationmay be adopted in which one set of opposing side wall parts 2020 arearranged so as to incline (have an inclination angle). Also in thiscase, a configuration is provided in which the side wall parts 2020 donot become parallel to each other. In addition, a configuration may beadopted in which two sets of opposing side wall parts 2020 are arrangedso as to incline.

Additionally, for example, as illustrated in FIG. 32, a configurationmay be adopted in which the ceiling part 2030 inclines with respect tothe bottom part 2010. In this case, a configuration is provided in whichthe bottom part 2010 and the ceiling part 2030 do not become parallel toeach other. In addition, the configuration illustrated in FIGS. 30 to 32and the configurations of the above respective descriptions can becombined together and applied.

As described above, the sound interference to the housing section 2040is reduced by providing a configuration in which the bottom part 2010and the ceiling part 2030 do not become parallel to each other, and theopposing side wall parts 2020 do not become parallel to each other.

In this case, the inclination angle between the bottom part 2010 and theceiling part 2030 and the inclination angle between the opposing sidewall parts 2020 can be set to be suitable angles according to thedistances between the wall surfaces, the wavelength of sound generatedin the housing section 2040, the wavelength of the sound propagated inthe housing section 2040, or the like.

Additionally, the same applies to the shapes, dimensions, and positionsof the protrusions 2020 d and the recesses 2020 e, and the same appliesto the protrusions or recesses provided in the bottom part 2010 or theceiling part 2030.

1-26. (canceled)
 27. A chamber system comprising: a housing section thatis surrounded by a bottom part, a side wall part, and a ceiling part andhouses a processing apparatus; an atmosphere-adjusting section thatadjusts the atmosphere inside the housing section; and an aerialvibration-attenuating section that is provided in each of the side wallpart, the ceiling part, and the atmosphere-adjusting section andattenuates aerial vibration outside the housing section. 28-37.(canceled)
 38. The chamber system according to claim 27, wherein theatmosphere-adjusting section has a gas supply system that supplies gasto the housing section, and wherein the aerial vibration-attenuatingsection is provided in the gas supply system.
 39. The chamber systemaccording to claim 38, wherein the gas supply system has a first branchpath and a second branch path that are branched, and the first branchpath and the second branch path have different path lengths.
 40. Thechamber system according to claim 27, wherein the atmosphere-adjustingsection has an exhaust system that exhausts gas from the housingsection, and wherein the aerial vibration-attenuating section isprovided in the exhaust system.
 41. The chamber system according toclaim 27, wherein the atmosphere-adjusting section has a circulationsystem that exhausts a gas from the housing section and returns theexhausted gas to the housing section, and wherein the aerialvibration-attenuating section is provided in the circulation system. 42.The chamber system according to claim 27, wherein theatmosphere-adjusting section has a flow passage through which the gasflows, and wherein the aerial vibration-attenuating section is providedat a position according to the shape of the flow passage in the flowpassage.
 43. The chamber system according to claim 27, wherein thebottom part and the ceiling part are formed so that the surface of thebottom part on the housing section side and the surface of the ceilingpart on the housing section side do not become parallel to each other.44. The chamber system according to claim 27, wherein the side wall parthas a plurality of surfaces on the housing section side, and is formedso that at least two of the plurality of surfaces do not become parallelto each other.
 45. The chamber system according to claim 43, wherein atleast one of the bottom part, the side wall part, and the ceiling parthas a plurality of irregular portions.
 46. The chamber system accordingto claim 27, wherein the aerial vibration-attenuating section has: adetecting unit that detects the frequency of aerial vibration in thehousing section; and a control unit that performs a control so thatvibration corresponding to a frequency according to a detection resultof the detecting unit is generated in at least some of the bottom part,the side wall part, the ceiling part, and the atmosphere-adjustingsection.
 47. The chamber system according to claim 27, wherein theaerial vibration-attenuating section has an absorbing member thatabsorbs the aerial vibration.
 48. (canceled)
 49. The chamber systemaccording to claim 27, wherein the aerial vibration-attenuating sectionhas a sound absorption portion that absorbs the aerial vibration. 50.The chamber system according to claim 27, wherein the aerialvibration-attenuating section has a resonating portion that resonateswith the aerial vibration.
 51. The chamber system according to claim 50,wherein the aerial vibration-attenuating section is formed so thatHelmholtz resonance is generated in the resonating portion.
 52. Thechamber system according to claim 50, wherein the resonating portionhas: a base portion having a recess formed therein; a lid portion thatcovers the base portion so as to block the recess; and a communicationportion that is formed in the lid portion and allows the inside of therecess and the outside of the recess to communicate with each other. 53.The chamber system according to claim 52, wherein at least one of therecess and the communication portion is formed with a specificationaccording to the frequency of the aerial vibration.
 54. The chambersystem according to claim 52, wherein the communication portion isformed on the housing section side so as to allow the inside of therecess and the inside of the housing section to communicate with eachother.
 55. The chamber system according to claim 52, wherein the lidportion is formed using metal.
 56. The chamber system according to claim52, wherein the resonating portion has a lid portion-supporting portionthat is provided in the recess and supports the lid portion.
 57. Thechamber system according to claim 56, wherein the resonating portion isprovided in at least the bottom part, and wherein the processingapparatus is placed on the resonating portion.
 58. The chamber systemaccording to claim 57, wherein a plurality of the lid portion-supportingportions are provided, and wherein the plurality of lidportion-supporting portions are arranged so that the density of theportions thereof corresponding to the processing apparatus becomeshigher than that of the other portions.
 59. The chamber system accordingto claim 27, wherein the processing apparatus includes at least one of ameasuring apparatus, a manufacturing apparatus, and a machiningapparatus.